View HSMC-C120_396566.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

w
w
w
.D
ta a
Sh
et e
4U
.
omAgilent HSMA/C/L-C120, c
Data Sheet
HSMD/G/S/H-C120, HSMM/N/Q/R-C120 Right Angle ChipLED
Features * Small size right angle mount * 0603 industry standard footprint * Operating temperature range of -30C to +85C * Available in various colors
Description This series of right angle mount ChipLEDs is designed with the smallest footprint to achieve high density of components on board. They have the industry standard footprint of 1.6 mm x 1.0 mm and a height of only 0.6 mm. This makes them very suitable for cellular phone and mobile equipment backlighting and
w
w
w
.D
indication application where space is a constraint. They are available in a wide range of color combination. In order to facilitate automated pick and place operation, these ChipLEDs are shipped in tape and reel, with 4000 units per reel. These parts are compatible with IR soldering.
t a
S a
e h
t e
U 4
* Compatible with IR solder reflow * Available in 8 mm tape on 7" diameter reel * Reel sealed in zip locked moisture barrier bags Applications * LCD backlighting * Keypad backlighting * Pushbutton backlighting * Symbol indicator
.c
m o
CAUTION: HSMM/N/Q/R-C120 LEDs are Class 1 ESD sensitive per MIL-STD-1686. Please observe appropriate precautions during handling and processing. Refer to Agilent Technologies Application Note AN-1142 for additional details.
w
w
w
.D
at
Sh a
et e
4U
.
om c
Package Dimensions
LED DIE
CATHODE MARK (ANODE MARK FOR HSMH-C120)
0.6 (0.024) 0.3 (0.012)
1.6 (0.063) POLARITY[3] 1.2 (0.047) CLEAR EPOXY
1.0 (0.039) PC BOARD 0.4 (0.016)
3 - 0.3 (0.012) CATHODE LINE
SOLDERING TERMINAL
NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 3. POLARITY FOR HSMH-C120 WILL BE THE OPPOSITE OF WHAT IS SHOWN ON ABOVE DRAWING.
Device Selection Guide AS AlInGaP Amber HSMA-C120 Red HSMC-C120 Orange HSML-C120 InGaN Green HSMM-C120 HSMQ-C120 Blue HSMN-C120 HSMR-C120 Package Description Untinted, Non Diffused
AlGaAs Red HSMH-C120
GaP Green HSMG-C120
Orange HSMD-C120
HER HSMS-C120
Package Description Untinted, Non Diffused
2
Absolute Maximum Ratings at TA = 25C Parameter DC Forward Current[1] [2] Power Dissipation Reverse Voltage (I R = 100 A) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature HSMA/C/L- HSMD/G/S- HSMHC120 C120 C120 25 20 25 60 52 65 5 5 5 95 95 95 -30 to +85 -40 to +85 See IR soldering profile (Figure 6) HSMM/NC120 20 78 5 95 HSMQ/RC120 20 78 5 95 Units mA mW V C C C
Notes: 1. Derate linearly as shown in Figure 4. 2. Drive currents above 5 mA are recommended for best long term performance.
Electrical Characteristics at TA = 25C Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. 1.9 2.4 1.9 2.4 1.9 2.2 2.2 2.1 1.8 3.4 3.4 3.4 3.4 2.4 2.6 2.6 2.6 2.6 3.9 3.9 3.9 3.9 Reverse Breakdown VR (Volts) @ IR = 100 A Min. 5 5 5 5 5 5 5 5 5 5 5 Capacitance C (pF), VF = 0, f = 1 MHz Typ. 11 15 20 7 9 5 20 45 45 100 100 Thermal Resistance RJ-PIN (C/W) Typ. 400 400 400 350 350 350 400 450 450 450 450
Part Number HSMA-C120 HSMC-C120 HSML-C120 HSMD-C120 HSMG-C120 HSMS-C120 HSMH-C120 HSMM-C120 HSMN-C120 HSMQ-C120 HSMR-C120
Note: 1. VF tolerance: 0.1 V
3
Optical Characteristics at TA = 25C Luminous Intensity Iv (mcd) @ 20 mA[1] Min. 25 25 25 2.5 4.0 2.5 4.0 40 10 40 16 Peak Wavelength peak[2] (nm) Typ. 595 637 609 605 570 630 660 523 468 520 469 Dominant Wavelength d[2] (nm) Typ. 592 626 605 604 572 626 639 525 470 527 473 Luminous Efficacy v (lm/w) Typ. 480 155 370 380 595 145 70 490 80 500 85
Part Number HSMA-C120 HSMC-C120 HSML-C120 HSMD-C120 HSMG-C120 HSMS-C120 HSMH-C120 HSMM-C120 HSMN-C120 HSMQ-C120 HSMR-C120
Typ. 90 90 90 8 15 10 15 120 30 145 55
Viewing Angle 2 1/2 Degrees[3] Typ. 155 155 155 155 155 155 155 155 155 155 155
Notes: 1.The luminous intensity Iv is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2.The coordinate is derived from the CIE Chromatically Diagram and represents the perceived color of the device. 3. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Light Intensity (Iv) Bin Limits[1] Bin ID A B C D E F G H J K L M N P Q R S T U Intensity (mcd) Min. Max. 0.11 0.18 0.18 0.29 0.29 0.45 0.45 0.72 0.72 1.10 1.10 1.80 1.80 2.80 2.80 4.50 4.50 7.20 7.20 11.20 11.20 18.00 18.00 28.50 28.50 45.00 45.00 71.50 71.50 112.50 112.50 180.00 180.00 285.00 285.00 450.00 450.00 715.00
Color Bin Limits [1] Green Color Bins Dom. Wavelength (nm) Bin ID Min. Max. A 561.5 564.5 B 564.5 567.5 C 567.5 570.5 D 570.5 573.5 E 573.5 576.5
Tolerance: 0.5 nm
Yellow/Amber Color Bins Dom. Wavelength (nm) Bin ID Min. Max. A 582.0 584.5 B 584.5 587.0 C 587.0 589.5 D 589.5 592.0 E 592.0 594.5 F 594.5 597.0
Tolerance: 0.5 nm
Blue Color Bins Dom. Wavelength (nm) Bin ID Min. Max. A 460.0 465.0 B 465.0 470.0 C 470.0 475.0 D 475.0 480.0
Tolerance: 1 nm
InGaN Green Color Bins Dom. Wavelength (nm) Bin ID Min. Max. A 515.0 520.0 B 520.0 525.0 C 525.0 530.0 D 530.0 535.0
Tolerance: 1 nm
Tolerance: 15%
4
Color Bin Limits
RELATIVE INTENSITY - %
100 90 80 70 60 50 40 30 20 10 0 500 550 600 650 700 750 GaP ORANGE GaP GREEN HER AlGaAs RED
Orange Color Bins Dom. Wavelength (nm) Bin ID Min. Max. A 597.0 600.0 B 600.0 603.0 C 603.0 606.0 D 606.0 609.0 E 609.0 612.0 F 612.0 615.0
Tolerance: 1 nm Notes: 1.Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins.
WAVELENGTH - nm
100
RELATIVE INTENSITY - %
90 80 70 60 50 40 30 20 10
InGaN BLUE
AS AMBER
AS ORANGE AS RED
InGaN GREEN
0 400
450
500
550 WAVELENGTH - nm
600
650
700
Figure 1. Relative intensity vs. wavelength.
100
IF - FORWARD CURRENT - mA
AS AllnGaP AlGaAs 10 HER GaP ORANGE
1
GaP GREEN
0.1 1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.3
VF - FORWARD VOLTAGE - V
100
IF - FORWARD CURRENT - mA
10 HSMM, HSMN InGaN 1
HSMQ, HSMR InGaN
0.1 1.5
2.0
2.5
3.0
3.5
4.0
VF - FORWARD VOLTAGE - V
Figure 2. Forward current vs. forward voltage.
5
1.2 1.0 0.8 AS AlInGaP 0.6 AlGaAs 0.4 GaP 0.2 0
1.2 1.0 0.8 HSMQ, HSMR InGaN 0.6 0.4 0.2 0 HSMM, HSMN InGaN
LUMINOUS INTENSITY (NORMALIZED AT 20 mA)
0
5
10
15
20
25
LUMINOUS INTENSITY (NORMALIZED AT 20 mA)
0
5
10
15
20
25
IF - FORWARD CURRENT - mA
IF - FORWARD CURRENT - mA
Figure 3. Luminous intensity vs. forward current.
IF MAX. - MAXIMUM FORWARD CURRENT - mA
30 25 20 GaP 15 10 5 0
IF MAX. - MAXIMUM FORWARD CURRENT - mA
25 HSMQ, HSMR InGaN 20
AlInGaP AlGaAs
15 HSMM, HSMN InGaN 10
5
0
10 20 30 40 50 60 70 80 90 TA - AMBIENT TEMPERATURE - C
0
0
10 20 30 40 50 60 70 80 90 TA - AMBIENT TEMPERATURE - C
Figure 4. Maximum forward current vs. ambient temperature.
6
100 90
RELATIVE INTENSITY
80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE 100 90
RELATIVE INTENSITY
80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
Figure 5. Relative intensity vs. angle.
10 SEC. MAX.
0.4 (0.016)
0.4 (0.016)
TEMPERATURE
230C MAX. 140-160C 4C/SEC. MAX. OVER 2 MIN. TIME
0.8 (0.031) 1.2 (0.047) 0.8 (0.031)
4C/SEC. MAX.
0.7 (0.028)
-3C/SEC. MAX.
0.15 (0.006) CENTERING BOARD
Figure 6. Recommended reflow soldering profile.
Figure 7. Recommended soldering pattern.
Note: All dimensions in millimeters (inches).
7
USER FEED DIRECTION
xxx xxxxx xxxxx xxxxx xxxxx
CATHODE SIDE
xx
PRINTED LABEL
Figure 8. Reeling orientation.
8.0 1.0 (0.315 0.039) 10.50 1.0 (0.413 0.039) 20.20 MIN. ( 0.795 MIN.)
13.1 0.5 ( 0.516 0.020) 3.0 0.5 (0.118 0.020)
178.40 1.00 (7.024 0.039)
59.60 1.00 (2.346 0.039)
4.0 0.5 (0.157 0.020)
6 PS
5.0 0.5 (0.197 0.020)
NOTE: ALL DIMENSIONS IN MILLIMETERS (INCHES).
Figure 9. Reel dimensions.
8
DIM. C (SEE TABLE 1) 2.00 0.05 (0.079 0.002) 4.0 (0.157) 1.50 (0.059) CATHODE 0.20 0.05 (0.008 0.002)
1.75 (0.069)
3.5 0.05 (0.138 0.002)
DIM. A (SEE TABLE 1) 8.0 0.30 (0.315 0.012)
4.0 (0.157)
DIM. B (SEE TABLE 1)
R 0.5 0.05 (0.020 0.002) USER FEED DIRECTION
CARRIER TAPE
COVER TAPE
TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER HSMx-C120 SERIES DIM. A DIM. B DIM. C 0.10 (0.004) 0.10 (0.004) 0.10 (0.004) 1.90 (0.075) 1.15 (0.045) 0.75 (0.030)
Figure 10. Tape dimensions.
END
START
THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCHES) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE.
MOUNTED WITH COMPONENTS.
THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCHES) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE.
MINIMUM OF 230 mm (9.05 IN.) MAY CONSIST OF CARRIER AND/OR COVER TAPE.
Figure 11. Tape leader. Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is 0.1 mm ( 0.004 in.) unless otherwise specified.
Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components.
Storage Condition: 5 to 30C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 60 +/- 5C for 20 hours.
9
www.agilent.com/semiconductors
For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6271 2451 India, Australia, New Zealand: (+65) 6271 2394 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6271 2194 Malaysia, Singapore: (+65) 6271 2054 Taiwan: (+65) 6271 2654 Data subject to change. Copyright (c) 2002 Agilent Technologies, Inc. April 6, 2002 5988-5401EN

▲Up To Search▲

Price & Availability of HSMC-C120

	To Download HSMC-C120 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .